Issued Patents 2022
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11515249 | Wiring package and method of manufacturing the same | Chih-Yi Huang, Mi-Chun Hung | 2022-11-29 |
| 11424167 | Semiconductor package structure and method for manufacturing the same | Chih-Yi Huang, Keng-Tuan Chang | 2022-08-23 |
| 11328999 | Semiconductor device package | Fu-Chen Chu, Hung-Chun KUO | 2022-05-10 |
| 11232998 | Semiconductor device package and method of manufacturing the same | Ming-Fong JHONG, Hung-Chun KUO | 2022-01-25 |
| 11222845 | Semiconductor device package | Po-I Wu | 2022-01-11 |