Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11011450 | Preparation method of a ceramic module for power semiconductor integrated packaging | Wei Kang, Xiaoquan Guo, Jun Zhang | 2021-05-18 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11011450 | Preparation method of a ceramic module for power semiconductor integrated packaging | Wei Kang, Xiaoquan Guo, Jun Zhang | 2021-05-18 |