Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11011450 | Preparation method of a ceramic module for power semiconductor integrated packaging | Zhaohui Wu, Xiaoquan Guo, Jun Zhang | 2021-05-18 |
| 10957571 | Apparatus and methods for determining wafer characters | Wen-Ting Tsai | 2021-03-23 |