Issued Patents 2021
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11101151 | Package substrate processing method | Mitsutane KOKUBU, Naoko Yamamoto, Chisato Yamada | 2021-08-24 |
| 11040427 | Workpiece processing method | — | 2021-06-22 |
| 10953516 | Grinding apparatus | — | 2021-03-23 |
| 10930512 | Method of processing workpiece | — | 2021-02-23 |
| 10930558 | Processing apparatus | — | 2021-02-23 |
| 10896822 | Grinding apparatus | Takayuki Gawazawa | 2021-01-19 |