Issued Patents 2021
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11189530 | Manufacturing method of chips | — | 2021-11-30 |
| 11167446 | Workpiece processing method | — | 2021-11-09 |
| 11171056 | Wafer processing method | — | 2021-11-09 |
| 11101151 | Package substrate processing method | Kenji Takenouchi, Mitsutane KOKUBU, Chisato Yamada | 2021-08-24 |