Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11158609 | Three-dimensional integrated package device for high-voltage silicon carbide power module | Xiaodong Hou, Cheng ZHAO, Jianpeng Wang, Dingkun Ma, Chengzi YANG +1 more | 2021-10-26 |
| 11043850 | Current phase locking and driver pulse generation method used in wireless charging for electric vehicles | Yongbin Jiang, Ruibang Li, Yonghui Liu, Min Wu, Jing Sun +3 more | 2021-06-22 |