Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11158609 | Three-dimensional integrated package device for high-voltage silicon carbide power module | Laili WANG, Xiaodong Hou, Cheng ZHAO, Dingkun Ma, Chengzi YANG +1 more | 2021-10-26 |