Issued Patents 2021
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11114401 | Bonding structure and method for manufacturing the same | Fei Liang, Jing Cao | 2021-09-07 |
| 11114414 | Wafer structure with capacitive chip interconnection, method for manufacturing the same, and chip structure with capacitive chip interconnection | Yang Li | 2021-09-07 |
| 11107856 | Manufacturing method of image sensing device | Peng SUN, Xilong Wang | 2021-08-31 |
| 11043448 | Semiconductor device with vertically separated openings and manufacturing method thereof | Yu Ting Zhou, Tianjian Liu, Changlin Zhao, Xing Hu | 2021-06-22 |
| 11024534 | Semiconductor device having opening and via hole and method for manufacturing the same | Beibei SHENG | 2021-06-01 |
| 10943853 | Semiconductor device and manufacturing method thereof | Xing Hu, Yu Ting Zhou, Tianjian Liu, Changlin Zhao | 2021-03-09 |