Issued Patents 2021
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11104043 | Thermal extrusion method to fabricate large-dimension superhydrophobic cylinder pillar arrays with droplet pancake bouncing phenomenon | Jinlong Song, Liu Huang, Mingqian Gao, Xin Peng Liu | 2021-08-31 |
| 11107794 | Multi-wafer stack structure and forming method thereof | Tianjian Liu | 2021-08-31 |
| 11043448 | Semiconductor device with vertically separated openings and manufacturing method thereof | Yu Ting Zhou, Tianjian Liu, Sheng HU, Xing Hu | 2021-06-22 |
| 10943853 | Semiconductor device and manufacturing method thereof | Xing Hu, Yu Ting Zhou, Tianjian Liu, Sheng HU | 2021-03-09 |