Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11024603 | Manufacturing method and a related stackable chip package | Hung-Hsin Hsu, Yuan-Fu Lan, Chi-An Wang, Hsien-Wen Hsu | 2021-06-01 |
| 10892250 | Stacked package structure with encapsulation and redistribution layer and fabricating method thereof | Hung-Hsin Hsu, Yuan-Fu Lan, Hsien-Wen Hsu | 2021-01-12 |