Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11024603 | Manufacturing method and a related stackable chip package | Ming-Chih Chen, Hung-Hsin Hsu, Yuan-Fu Lan, Chi-An Wang | 2021-06-01 |
| 10892250 | Stacked package structure with encapsulation and redistribution layer and fabricating method thereof | Ming-Chih Chen, Hung-Hsin Hsu, Yuan-Fu Lan | 2021-01-12 |