Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 11145596 | Package structure and method of forming the same | — | 2021-10-12 | $2,227,000 |
| 11063010 | Redistribution layer (RDL) structure and method of manufacturing the same | Jin-Neng Wu, Hsin-Hung Chou, Chun-Hung Lin | 2021-07-13 | $2,872,000 |