Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 11063010 | Redistribution layer (RDL) structure and method of manufacturing the same | Yen-Jui Chu, Jin-Neng Wu, Chun-Hung Lin | 2021-07-13 | $2,872,000 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 11063010 | Redistribution layer (RDL) structure and method of manufacturing the same | Yen-Jui Chu, Jin-Neng Wu, Chun-Hung Lin | 2021-07-13 | $2,872,000 |