Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 10927000 | MEMS structure with an etch stop layer buried within inter-dielectric layer | Li-Che Chen, Chia-Huei Lin, Hui-Min Wu, Kun-Che Hsieh, Kuan-Yu Wang +1 more | 2021-02-23 | $3,401,000 |