Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10927000 | MEMS structure with an etch stop layer buried within inter-dielectric layer | Li-Che Chen, Te-Yuan Wu, Chia-Huei Lin, Hui-Min Wu, Kun-Che Hsieh +1 more | 2021-02-23 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10927000 | MEMS structure with an etch stop layer buried within inter-dielectric layer | Li-Che Chen, Te-Yuan Wu, Chia-Huei Lin, Hui-Min Wu, Kun-Che Hsieh +1 more | 2021-02-23 |