Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11114543 | Group III-V device structure | Ming-Hong Chang, Chih-Yuan Chan, Shen-Ping Wang, Chung-Cheng Chen, Po-Tao Chu | 2021-09-07 |
| 11069630 | Structures and methods for reducing thermal expansion mismatch during integrated circuit packaging | Kuen-Shian Chen | 2021-07-20 |