Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11069630 | Structures and methods for reducing thermal expansion mismatch during integrated circuit packaging | Chien-Li Kuo | 2021-07-20 |
KC
Kuen-Shian Chen
Overall (2021): #368,569 of 548,734Top 70%
1
Patents 2021