Issued Patents 2021
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11081421 | IGBT module with heat dissipation structure having ceramic layers corresponding in position and in area to chips | TZE-YANG YEH, Chun-Lung Wu | 2021-08-03 |
| 11037857 | IGBT module with heat dissipation structure having copper layers of different thicknesses | TZE-YANG YEH, Chun-Lung Wu | 2021-06-15 |
| 10998258 | Circuit carrier and manufacturing method thereof | — | 2021-05-04 |
| 10964634 | Method of manufacturing circuit carrier with embedded semiconductor substrate | Chien-Chen Lin, Kuan-Wen Fong | 2021-03-30 |
| 10943846 | Chip package structure with heat conductive component and manufacturing thereof | Chien-Chen Lin, Kuan-Wen Fong | 2021-03-09 |