Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11081421 | IGBT module with heat dissipation structure having ceramic layers corresponding in position and in area to chips | Tzu-Hsuan Wang, Chun-Lung Wu | 2021-08-03 |
| 11037857 | IGBT module with heat dissipation structure having copper layers of different thicknesses | Tzu-Hsuan Wang, Chun-Lung Wu | 2021-06-15 |