Issued Patents 2021
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11097718 | Hybrid vehicle | — | 2021-08-24 |
| 10985065 | Method of dicing a wafer by pre-sawing and subsequent laser cutting | Yohei Yamashita, Tsubasa Obata | 2021-04-20 |
| 10924296 | Terminal apparatus, control apparatus, installation-location-ascertainment support system, installation-location-setting support system, installation-location-ascertainment support method, installation-location-setting support method, and program | Hirotoshi YANO, Masaaki Yabe, Satoshi Minezawa, Ichiro Maruyama | 2021-02-16 |
| 10913442 | Hybrid vehicle | — | 2021-02-09 |
| 10895469 | Hybrid vehicle and method of controlling hybrid vehicle | — | 2021-01-19 |