Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10985065 | Method of dicing a wafer by pre-sawing and subsequent laser cutting | Tsubasa Obata, Yuki Ogawa | 2021-04-20 |
| 10967235 | Bat system with performance limiting structure and methods of making same | Kohei Kikuchi, David T. Llewellyn, Thu Nguyen, Chi-Hung Lee, Renqin Zhang | 2021-04-06 |