Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11133348 | Sensor package structure and sensing module thereof | CHIEN-CHEN LEE, Jian-Ru Chen, Chen Peng | 2021-09-28 |
| 10964615 | Chip-scale sensor package structure | CHIEN-CHEN LEE, Hsiu-Wen Tu | 2021-03-30 |