Issued Patents 2021
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11133348 | Sensor package structure and sensing module thereof | LI-CHUN HUNG, Jian-Ru Chen, Chen Peng | 2021-09-28 |
| 10964615 | Chip-scale sensor package structure | LI-CHUN HUNG, Hsiu-Wen Tu | 2021-03-30 |
| 10916511 | Method for reducing warpage occurred to substrate strip after molding process | Fu-Chou Liu, Ya-Han Chang | 2021-02-09 |