Issued Patents 2021
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11211369 | Service module for SIP devices | Gene A. Frantz | 2021-12-28 |
| 11171126 | Configurable substrate and systems | Gene A. Frantz, Neeraj Kumar Reddy Dantu | 2021-11-09 |
| 11157676 | Method for routing bond wires in system in a package (SiP) devices | Neeraj Kumar Reddy Dantu, Gene A. Frantz | 2021-10-26 |