Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11171126 | Configurable substrate and systems | Masood Murtuza, Gene A. Frantz | 2021-11-09 |
| 11157676 | Method for routing bond wires in system in a package (SiP) devices | Masood Murtuza, Gene A. Frantz | 2021-10-26 |