Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11056490 | Process enhancement using double sided epitaxial on substrate | Bradley David Sucher | 2021-07-06 |
| 11043467 | Flip chip backside die grounding techniques | — | 2021-06-22 |
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11056490 | Process enhancement using double sided epitaxial on substrate | Bradley David Sucher | 2021-07-06 |
| 11043467 | Flip chip backside die grounding techniques | — | 2021-06-22 |