Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10893603 | Heat dissipation substrate, heat dissipation circuit structure body, and method for manufacturing the same | Hiroaki Umeda, Kazuhiro Matsuda | 2021-01-12 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10893603 | Heat dissipation substrate, heat dissipation circuit structure body, and method for manufacturing the same | Hiroaki Umeda, Kazuhiro Matsuda | 2021-01-12 |