Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11191198 | Shield package | Hiroaki Umeda, Hajime Nakazono, Hidetoshi Noguchi | 2021-11-30 |
| 10893603 | Heat dissipation substrate, heat dissipation circuit structure body, and method for manufacturing the same | Hiroaki Umeda, Ken Yukawa | 2021-01-12 |