Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10926360 | Lead-free solder alloy, solder joint, solder paste composition, electronic circuit board, and electronic device | Masaya Arai, Takeshi Nakano, Atsushi Hori, Yurika Munekawa, Daisuke Maruyama | 2021-02-23 |