Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11190607 | Communication monitoring apparatus, communication monitoring method, and computer-readable non-transitory storage medium | Shouhei Fukuzaki | 2021-11-30 |
| 10926360 | Lead-free solder alloy, solder joint, solder paste composition, electronic circuit board, and electronic device | Takeshi Nakano, Atsushi Hori, Tsukasa KATSUYAMA, Yurika Munekawa, Daisuke Maruyama | 2021-02-23 |