Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11164755 | Electronic package and method for fabricating the same | Yi-Chian Liao, Kong-Toon Ng, Chang-Fu Lin | 2021-11-02 |
| 10923566 | Semiconductor structures and methods of forming the same | Yu-Lien Huang, Meng-Ku Chen | 2021-02-16 |