Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11164755 | Electronic package and method for fabricating the same | Yung-Ta Li, Yi-Chian Liao, Chang-Fu Lin | 2021-11-02 |
| 11056470 | Electronic package and method for fabricating the same | Hung-Ho Lee, Chee-Key Chung, Chang-Fu Lin, Chi-Hsin Chiu | 2021-07-06 |