Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11073551 | Method and system for wafer-level testing | Jun He, Yu-Ting Lin, Wei-Hsun Lin, Yung-Liang Kuo | 2021-07-27 |
| 10957664 | Semiconductor structure and manufacturing method thereof | Tung-Jiun Wu, Mingni Chang, Ming-Yih Wang | 2021-03-23 |