Issued Patents 2021
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11088092 | Via rail solution for high power electromigration | Kam-Tou Sio, Chih-Ming Lai, Chun-Kuang Chen, Chih-Liang Chen, Charles Chew-Yuen Young +3 more | 2021-08-10 |
| 11087061 | Method and system for improving propagation delay of conductive line | Hung-Chih Ou | 2021-08-10 |
| 11063005 | Via rail solution for high power electromigration | Kam-Tou Sio, Chih-Ming Lai, Chun-Kuang Chen, Chih-Liang Chen, Charles Chew-Yuen Young +3 more | 2021-07-13 |
| 11030383 | Integrated device and method of forming the same | Chun-Yao Ku, Ming-Tao Yu, Shao-Huan Wang, Jyun-Hao Chang | 2021-06-08 |
| 10990745 | Integrated circuit and method of forming same and a system | Sheng-Hsiung Chen, Shao-Huan Wang, Chun-Yao Ku, Hung-Chih Ou | 2021-04-27 |
| 10977420 | Method of decomposing a layout for multiple-patterning lithography | Meng-Kai Hsu | 2021-04-13 |
| 10975105 | Composition for substrate surface modification and method using the same | Chen-Han Huang, Hsing-Ying Lin | 2021-04-13 |
| 10956650 | Systems and methods for improving design performance through placement of functional and spare cells by leveraging LDE effect | Chun-Yao Ku, Jyun-Hao Chang, Ming-Tao Yu | 2021-03-23 |
| 10943046 | Semiconductor apparatus including uncrowned and crowned cells and method of making | Prasenjit Ray, Lee-Chung Lu, Meng-Kai Hsu, Yuan-Te Hou | 2021-03-09 |