Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11162777 | Wafer alignment mark scheme | Chin-Hsiang Lin, Heng-Hsin Liu, Jui-Chun Peng, Ho-Ping Chen | 2021-11-02 |
| 11014103 | Substrate processing apparatus and substrate processing method | Yung-Yao Lee | 2021-05-25 |