Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11024634 | Semiconductor device having an inter-layer via (ILV), and method of making same | Hong-Chen Cheng, Cheng Hung Lee, Hung-Jen Liao | 2021-06-01 |
TH
Tsung-Hsien Huang
Overall (2021): #225,123 of 548,734Top 45%
1
Patents 2021