Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11037854 | Thermal dissipation through seal rings in 3DIC structure | Jing-Cheng Lin | 2021-06-15 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11037854 | Thermal dissipation through seal rings in 3DIC structure | Jing-Cheng Lin | 2021-06-15 |