HL

Hsien-Chin Lin

TSMC: 2 patents #1,187 of 3,494Top 35%
Overall (2021): #155,587 of 548,734Top 30%
2
Patents 2021

Issued Patents 2021

Showing 1–2 of 2 patents

Patent #TitleCo-InventorsDate
10991628 Etch stop layer between substrate and isolation structure Ming-Chang Wen, Chang-Yun Chang, Hung-Kai Chen 2021-04-27
10978351 Etch stop layer between substrate and isolation structure Ming-Chang Wen, Chang-Yun Chang, Hung-Kai Chen 2021-04-13