Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10964547 | Method of fabricating semiconductor structure | Chin-Han Meng, Jr-Sheng Chen, An-Chi Li, Lin-Ching Huang, Yu-Pei Chiang | 2021-03-30 |
| 10964653 | Method of forming a semiconductor device comprising top conductive pads | Ya-Ping Su, Han-Wen Fung, Chia-Chi Chung, Chun Yan Chen, Chien-Sheng Wu +3 more | 2021-03-30 |