Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10889086 | Resin film, substrate for printed wiring board, and printed wiring board | Kayo HASHIZUME, Yoshio Oka, Masamichi Yamamoto, Takashi Kasuga, Hideki Kashihara +1 more | 2021-01-12 |