Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11013113 | Base material for printed circuit board and printed circuit board | Motohiko SUGIURA, Issei Okada, Yoshio Oka, Kenji Ohki | 2021-05-18 |
| 10889086 | Resin film, substrate for printed wiring board, and printed wiring board | Kayo HASHIZUME, Yoshio Oka, Masamichi Yamamoto, Yugo Kubo, Hideki Kashihara +1 more | 2021-01-12 |