Issued Patents 2021
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11171110 | Backside metalization with through-wafer-via processing to allow use of high q bondwire inductances | Bharatjeet Singh Gill | 2021-11-09 |
| 11128263 | Temperature compensated power amplifier gain | Gordon Glen Rabjohn, Edward John Wemyss Whittaker | 2021-09-21 |