Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11171110 | Backside metalization with through-wafer-via processing to allow use of high q bondwire inductances | Grant Darcy Poulin | 2021-11-09 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11171110 | Backside metalization with through-wafer-via processing to allow use of high q bondwire inductances | Grant Darcy Poulin | 2021-11-09 |