Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10991637 | Wafer-level chip-scale package including power semiconductor and manufacturing method thereof | Myung Ho Park, Beom Su Kim | 2021-04-27 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10991637 | Wafer-level chip-scale package including power semiconductor and manufacturing method thereof | Myung Ho Park, Beom Su Kim | 2021-04-27 |