Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10991637 | Wafer-level chip-scale package including power semiconductor and manufacturing method thereof | Beom Su Kim, Sun Hwan Kim | 2021-04-27 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10991637 | Wafer-level chip-scale package including power semiconductor and manufacturing method thereof | Beom Su Kim, Sun Hwan Kim | 2021-04-27 |