Issued Patents 2021
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11177184 | Method of manufacturing a flip chip package and an apparatus for testing flip chips | Dong Jin Kim, Byeung Ho Kim, Chang Hyun Kim | 2021-11-16 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11177184 | Method of manufacturing a flip chip package and an apparatus for testing flip chips | Dong Jin Kim, Byeung Ho Kim, Chang Hyun Kim | 2021-11-16 |