Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11177184 | Method of manufacturing a flip chip package and an apparatus for testing flip chips | Jee Won Chung, Dong Jin Kim, Chang Hyun Kim | 2021-11-16 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11177184 | Method of manufacturing a flip chip package and an apparatus for testing flip chips | Jee Won Chung, Dong Jin Kim, Chang Hyun Kim | 2021-11-16 |