Issued Patents 2021
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11211687 | Method of fabricating a semiconductor structure with an antenna module | Yenheng Chen, Jangshen Lin, Chengchung Lin | 2021-12-28 |
| 11133568 | Semiconductor package structure having antenna module | Yenheng Chen, Chengchung Lin | 2021-09-28 |
| 11114391 | Antenna package structure and antenna packaging method | Yenheng Chen, Chengchung Lin, Jangshen Lin | 2021-09-07 |
| 10916829 | Semiconductor package structure having antenna module | Yenheng Chen, Chengchung Lin | 2021-02-09 |
| 10886243 | Fan-out antenna packaging structure and preparation thereof | Yenheng Chen, Chengchung Lin, Jangshen Lin | 2021-01-05 |
| 10886594 | Packaging structure and packaging method for antenna | Yenheng Chen, Chengchung Lin, Jangshen Lin | 2021-01-05 |