Issued Patents 2021
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11211687 | Method of fabricating a semiconductor structure with an antenna module | Yenheng Chen, Chengtar Wu, Jangshen Lin | 2021-12-28 |
| 11211343 | Fan-out antenna packaging structure and packaging method | Yenheng Chen | 2021-12-28 |
| 11133568 | Semiconductor package structure having antenna module | Yenheng Chen, Chengtar Wu | 2021-09-28 |
| 11121065 | Semiconductor packaging structure with antenna assembly | Yenheng Chen, Chentar Wu | 2021-09-14 |
| 11114391 | Antenna package structure and antenna packaging method | Yenheng Chen, Chengtar Wu, Jangshen Lin | 2021-09-07 |
| 10971467 | Packaging method and package structure of fan-out chip | Yuedong Qiu | 2021-04-06 |
| 10916829 | Semiconductor package structure having antenna module | Yenheng Chen, Chengtar Wu | 2021-02-09 |
| 10886243 | Fan-out antenna packaging structure and preparation thereof | Yenheng Chen, Chengtar Wu, Jangshen Lin | 2021-01-05 |
| 10886594 | Packaging structure and packaging method for antenna | Yenheng Chen, Chengtar Wu, Jangshen Lin | 2021-01-05 |