Issued Patents 2021
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10916526 | Method for fabricating electronic package with conductive pillars | Chih-Hsien Chiu, Chia-Yang Chen | 2021-02-09 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10916526 | Method for fabricating electronic package with conductive pillars | Chih-Hsien Chiu, Chia-Yang Chen | 2021-02-09 |